From: tomatom@juno.com
Date: 04/15/00-12:36:25 PM Z
on the altcpu-list@topica.com , 2 yrs ago they discovered
that using "silver-based conductive/thermal paste " can lower
the cpu temp as much as 13 degrees C. !!! but i suspect
that in the high (13) case, the previous heat sink paste was
improperly applied ( too much/or too little )...expect 8-10...
you can also polish the cpu top and heat sink bottom with
600 w/d emory paper---when 2 metal surfaces come into contact,
there are pits and valleys that cause the TOTAL surface contact
to result in only 1% to 10% !!! that's why you NEED somekind
of paste to fill the air pocket/insulating voids !!! i've tried the
al foil and copper sheet fixes, but didn't have the thermosisters
for serious tests---when heat is a problem, like over-clocking ;) ,
go for the silver-paste ( $6-$11 for a tiny tube, but use a single-edge
razorblade to apply a super thin coat, so many applications from
a 1/8 oz. tube )
speaking of o'clocking, is there a 75 mhz jumper on the
iOpener ???
On Sat, 15 Apr 2000 11:03:45 -0400 Guy Gordon <gordon@white-crane.com>
writes:
> The thermal engineering of the iopener seems way out of line with the
> electrical and mechanical engineering -- both of which are well done.
>
> The circuit board is a thing of beauty and economy. The physical
> design makes you want to own one at first sight. But why do the
> heatsink grooves go horizontal instead of vertical? Why does the
> heatsink stand off so far from the cpu that it needs a spacer. Why
> did they use a plastic pad for a spacer instead of metal?
>
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